REFLOW SOLDERING OVEN ISO
REFLOW SOLDERING OVEN PLUS

The forced air circulation results in a uniform temperature profile along the entire circuit board assembly. With the nitrogen inerting option, the isolated chamber design maintains low oxygen levels while conserving nitrogen consumption.

The air is circulated toward one side of the oven above the PCB and toward the opposite side of the oven below the PCB, forming a 'cyclone' around the board. Furukawa Electric, a leading manufacturer of reflow soldering systems, has now developed an oven designed for the Sn-Ag process, which at present seems to show.

REFLOW SOLDERING OVEN ISO

ISO 9000 SPC fault monitoring and reportingĪPS's patented Horizontal Convection™* system propels heated air currents within each chamber.

REFLOW SOLDERING OVEN PLUS

GF-120HC uses all Horizontal Convection* heating technologyħ3' long benchtop oven with 41' long heated tunnel, plus 12' long cooling zoneģ vertical heating zones plus cooling zone Individuals primarily use reflow ovens for the thermal processing of soldering surface-mount electronic components to circuit boards. Real reflow soldering wont start until those preparations have been fully made. Model HT for high temp Lead Free Soldering applications up to 400C (752F) GF-120HC uses all Horizontal Convection. The Desktop RF100 Batch PCB Solder Reflow oven has been designed for the reflow of all common high temperature alloys, including both Lead and Lead free. Model HT for high temp Lead Free Soldering applications up to 400☌ (752☏) Then, components are placed on pads by pick and place machine.

Reflow soldering oven